By Steinberg, Dave S.
This e-book info infallible innovations for designing digital to resist serious thermal environments. It additionally bargains mathematical modeling functions, utilizing analog resistor networks, to supply the breakup of advanced structures into a number of person thermal resistors and nodes should you favor high-speed electronic desktop options to thermal difficulties.
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Extra resources for Cooling Techniques for Electronic Equipment
Even if the grease is not in contact with the cemented joint, the migration will carry it to the joint before the epoxy is applied. This prevents the epoxy from bonding properly, resulting in a weakened joint. 3 SAMPLE PROBLEM-TRANSISTOR MOUNTED ON A BRACKET 37 If the chassis will experience any vibration or shock, it is a good idea to use mechanical fasteners such as rivets or screws with the epoxy to improve the bond. Cantilevered brackets should be avoided in shock and vibration environments because they have low resonant frequencies and high transmissibilities.
9 is used to determine the temperature rise from the center of the PCB to the edge for one strip of components, using English units and metric units. 0717 calisec (ref. 20 k ! 0028 in n 4 Uniformly distributed heat load on one copper strip. 00361 cm2 K = Substitute into Eq. 9 to obtain the temperature rise along the strip using English units. 12a) ft2) = Substitute into Eq. 9 using metric units At = The amount of heat that can be removed by radiation or convection for this type of system is very small.
16 [15, 17, 241. R, = R, + R, + R3 + * . 8. The total effective resistance for the parallel flow network is determined by combining the individual resistances as shown in Eq. 17 [15, 17, 241. 17) A typical electronic system will normally consist of many different combinations of series and parallel flow resistor networks. 10 SAMPLE PROBLEM-HEAT BULKHEAD FLOW ALONG NONUNIFORM An aluminum bulkhead is used to support a row of six power resistors. 5 watts, for a total power dissipation of 9 watts. The bulkhead conducts the heat to the opposite wall of the chassis, which is cooled by a multiple fin heat exchanger.
Cooling Techniques for Electronic Equipment by Steinberg, Dave S.